发明名称 |
Solid-state image pick-up device and method for manufacturing the same |
摘要 |
A solid-state image pick-up device having a structure in which the amount of transferred charges is not reduced in a vertical CCD portion even if a pixel portion is made finer, and a method for manufacturing the solid-state image pick-up device are provided. A first p-type well and a second p-type well are formed on an N (100) silicon substrate. A vertical CCD n+ layer is formed in the second p-type well 3. Then, impurity ions are implanted into a surface layer of the N (100) silicon substrate including an upper layer portion of the vertical CCD n+ layer to form a p- layer. An isolating portion for isolating photodiode portions from the vertical CCD n+ layer and a read control portion for controlling the read of charges from the photodiode n layer are simultaneously formed on a portion adjacent to the vertical CCD n+ layer.
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申请公布号 |
US5786607(A) |
申请公布日期 |
1998.07.28 |
申请号 |
US19960654962 |
申请日期 |
1996.05.29 |
申请人 |
MATSUSHITA ELECTRONICS CORPORATION |
发明人 |
ISHIKAWA, KATSUYA;KURODA, TAKAO;MATSUDA, YUJI;NIWAYAMA, MASAHIKO;TACHIKAWA, KEISHI |
分类号 |
H01L27/148;(IPC1-7):H01L27/148;H01L29/768 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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