发明名称 Integrated circuit with identification signal writing circuitry distributed on multiple metal layers
摘要 An integrated circuit includes a first metal layer with first layer identification signal writing circuitry connections to produce first metal layer circuit identification signals. The integrated circuit also has a second metal layer with second layer identification signal writing circuitry connections to produce second metal layer circuit identification signals. Logic circuitry in the first metal layer has input connections to the first layer identification signal writing circuitry connections and the second layer identification signal writing circuitry connections. The logic circuitry combines the first metal layer circuit identification signals and the second metal layer circuit identification signals to produce a circuit identification number. The value of the circuit identification number can be changed by altering the first layer identification signal writing circuitry connectors or the second layer identification signal writing circuitry connections. Thus, the value of the circuit identification number can be easily changed at the metal layer at which revisions are made.
申请公布号 US5787012(A) 申请公布日期 1998.07.28
申请号 US19950560040 申请日期 1995.11.17
申请人 SUN MICROSYSTEMS, INC. 发明人 LEVITT, MARC E.
分类号 G06F11/00;H01L23/544;(IPC1-7):G06F17/50;G01R31/317 主分类号 G06F11/00
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