发明名称 Hermetic package for an electrical device
摘要 An electrical device package includes an aluminum header having a gold-coated sealing surface and an electrical device mounted within the boundary defined by the sealing surface. An annular gold-coated stainless steel seal ring registers with the sealing surface of the header. An annular bonding layer of a gold-tin alloy lies between, and registers with, the sealing surface of the aluminum header and the stainless steel seal ring. The electrical device is fastened to the header using an electrically and thermally conductive epoxy adhesive. A stainless steel cover has a flange which is welded to the seal ring to form a hermetically sealed package.
申请公布号 US5786548(A) 申请公布日期 1998.07.28
申请号 US19960689857 申请日期 1996.08.15
申请人 HUGHES ELECTRONICS CORPORATION 发明人 FANUCCHI, RICHARD;HUANG, DANIEL A.;IGAWA, BRUCE A.;PAET, BRILL C.;SUYEMATSU, HERBERT T.
分类号 H01L21/50;H01L23/10;H01L23/66;H05K5/00;(IPC1-7):H05K5/06 主分类号 H01L21/50
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