Method of manufacturing semiconductor component

摘要

A polymeric organic coating (24) used to package a semiconductor component (10) increases voltage isolation, decreases thermal resistance, and increases scratch and abrasion resistance for the semiconductor component (10). The coating (24) is applied to a leadframe (14) of the semiconductor component (10) using a chemical grafting process that involves the use of monomers, prepolymers, a catalyst, a graft initiator, and other ingredients. The coating (24) forms a polymeric organic film that is chemically bonded to the surfaces of the leadframe (14). The chemical grafting process produces a chemical bond, which improves adhesion between the coating (24) and the leadframe (14).