| 摘要 |
A method of cutting a plate-like wafer, particularly a semiconductor wafer, while removing a deposited material from along a scribe line. The deposited material having a width generally greater than the width of the saw blade. The method includes making one scribing cut to one side of the scribe line, making a second scribing cut to the other side of the scribe line, and making a severing cut along the scribe line to dice the wafer.
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