| 摘要 |
The present invention includes an apparatus and method for continuously adjusting the anode/cathode distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead screw which, when manually turned, moves the cathode head in or out in relation to the anode basket. Alternatively, the lead screw mechanism is driven by a servo motor and is suitably controlled by a computer which monitors the voltage and current in the electroforming cell and adjusts the screw accordingly. The present invention also includes an apparatus and method for a hinged, coated, metal clamping mechanism for fixturing a master against a backplate. To avoid plating of the metallic clamping ring, the metal is coated with a suitable substantially non-conductive, substantially non-chipping, extremely thin material. A hinge mechanism is incorporated onto the clamping ring to allow rotation of the clamping ring, thereby allowing an operator to quickly load or unload parts because of the ease and quickness in opening and closing of the fixture.
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