ELECTRONIC COMPONENT MOUNTING DEVICE

摘要

An electronic component mounting device which is small-sized and enables high-speed operation for mounting a chip-like electronic component on a printed board is to be provided. First and second drive systems (12, 13) are provided for driving first and second supply sections (2, 3), respectively, laid out on both lateral sides of a table section (6). The layout pitches of suction nozzles (18) of each supply section, the drive systems (12, 13), and each cassette (4) of the supply sections are made equal. With this structure, an electronic component mounting device which is small-sized and enables high-speed mounting is provided.