Forming laminated ceramic substrate with conductive contacts on one main surface

摘要

The method fills through-holes of the first layer with a conductive part to form through sections, each fitted with conductive contacts on the layer surface. On each through section a wiring pattern is formed on the rear face of the layer opposite to the contacts for electric coupling of the laser to the through sections. Second through holes are formed in a second green ceramic layer corresp. to the wiring pattern, as a second substrate layer. The second through holes are filled with a conductive part to form second through sections. The two layers are stacked to contact the second through sections and the first layer contacts by the first through sections and the wiring pattern. Then the two layers are fired.