A chip-card module (1) comprising a chip carrier (2), electrically conductive contact surfaces (3) and semiconductor chip contacted with the contact surfaces. The semiconductor chip is arranged in a surface mount (SMT) housing (4). It contacts the contact surfaces or lands (3) via terminal tags (5) brought out from the SMT-housing. The SMT-housing is a chip-size package, while the chip carrier is specifically a plastics foil. The terminal tags (5) are contacted with the contact lands with the aid of solder paste (6), or more specifically with the aid of electrically conductive adhesive.
