发明名称 |
Thermally isolated integrated circuit |
摘要 |
Thermally isolated circuit formed on a semiconductor on insulator structure includes a semiconductor surrounded by a semiconductor outer portion with an insulator therebetween. A cavity formed in the underlying semiconductor substrate opposite to the island provides thermal isolation.
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申请公布号 |
US5783854(A) |
申请公布日期 |
1998.07.21 |
申请号 |
US19960729208 |
申请日期 |
1996.10.15 |
申请人 |
HONEYWELL INC. |
发明人 |
DRIES, MICHAEL F.;ROISEN, ROGER L. |
分类号 |
H01L27/02;(IPC1-7):H01L31/058 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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