发明名称 |
Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate |
摘要 |
According to the present invention, a technique for controlling the flow of plastic encapsulant which is applied over an integrated circuit (I/C) chip wire bonded to wire pads formed on a chip carrier substrate is provided. This technique includes applying a barrier material to the substrate surrounding the wire bond pads, which barrier material is in the form of two walls projecting upwardly from the surface thereof, and defining a well between the walls to confine the flow of the encapsulant material. This prevents the encapsulant material from flowing past a desired defined boundary and covering the circuit connection pads which are not intended to be covered.
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申请公布号 |
US5784260(A) |
申请公布日期 |
1998.07.21 |
申请号 |
US19960657469 |
申请日期 |
1996.05.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FULLER, JR., JAMES W.;FLETCHER, MARY BETH;KOTYLO, JOSEPH ALPHONSE;KNIGHT, JEFFREY ALAN;PASSANTE, DAVID MICHAEL;MORING, ALLEN F. |
分类号 |
H01L21/56;H01L21/60;H01L23/24;H01L23/31;(IPC1-7):H05K1/18;H05K7/02 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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