| 摘要 |
PROBLEM TO BE SOLVED: To minimize the variation in the resistance value of a diffused resistor before and after a package assembly process by installing a functional circuit, while parts for the functional circuit are integrated at the central site of a chip body, connecting resistance elements to the functional circuit, and integrating and mounting resistance elements on the outer circumferential side of a functional circuit region. SOLUTION: A functional circuit 3 is integrated and set up at the central site of a chip body 1, and resistance element 2 being connected to the functional circuit 3 and requiring high precision are formed in an array shape, in a region retreating to the inside by a distance (a) from an outer edge 1a of the chip body 1 on the outer circumferential side of the functional circuit 3 and installed, while being regulated in a region which is within one third toward a center from the outer edge 1a of the chip body 1 and on the outside from the region of the functional circuit 3. Since the resistance elements 2 are formed to the peripheral section of a chip having a minimum effect from a piezoresistance effect in the chip body 1, the variation of a resistance value before and after a package assembly process can be minimized. |
