| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus whose installation area can be reduced. SOLUTION: Treatment regions A, B contain first hierarchies A1, B1, second hierarchies A2, B2, third hierarchies A3, B3 and fourth hierarchies A4, B4 which are arranged sequentially from the upper part to the lower part. A chemical unit 1 is arranged in the first hierarchies A1, B1, and a rotary coating unit 2a and a rotary developing unit 2b are arranged in the second hierarchies A2, B2. Air regulating units 3 are arranged in the third hierarchies A3, B3. Cooling units CP and heating units HP are arranged in the fourth hierarchies A4, B4. A conveyance region C is arranged between the treatment regions A, B. A separation plate 51 is installed at the upper part of the conveyance region C. |
