| 发明名称 |
Method of coupling titanium to a semiconductor substrate and semiconductor device thereof |
| 摘要 |
A semiconductor device (10) includes a semiconductor substrate (11) underlying an oxide layer (12). A layer (13) comprised of titanium overlies the oxide layer (12). The oxide layer (12) improves the adhesion of the layer (13) comprised of titanium to the semiconductor substrate (11).
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| 申请公布号 |
US5783487(A) |
申请公布日期 |
1998.07.21 |
| 申请号 |
US19960603294 |
申请日期 |
1996.02.20 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
WEEKS, ANTHONY R.;KASARSKIS, JR., VINCENT J.;EUDY, JR., HENRY L. |
| 分类号 |
H01L21/285;H01L23/532;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/285 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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