| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip module capable of easily manufacturing at sufficiently narrow pitch, even in a bus line in wide bus width required between an image processing logic circuit and an image data momory circuit and its manufacturing method. SOLUTION: Memory chips 10 and logic chips 11 have been previously manufactured in respective wafer process. These chips are bond-fixed at specific positions on a metallic module substrate 12, so that semiconductor substrate side may be opposite to a module substrate 12. In such a constitution, although one module makes a pair of memory chip 10 and logic chip 11, the memory chips 10 and the logic chips 11 in the same modules are to be juxtaposed on a single module substrate 12, so that multiple pairs of modules may be bonded together, thereby enabling the later processing of wiring step, etc., to be collectively performed. |
