CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To retain an electrical connection between a semiconductor package and a semiconductor device by a method wherein the semiconductor device is brazed to a wiring board, and specific filler which contains thermosetting resin is injected into a joint space between a semiconductor package and the semiconductor device and cured. SOLUTION: A semiconductor device A equipped with a connecting electrode is placed on a wiring board equipped with an insulating board 1 of thermal expansion coefficient of 8-25ppm/ deg.C at temperatures of 40-400 deg.C and a metallized wiring layer 2 provided onto the surface of the board 1. The metallized wiring layer 2 of the wiring board and the connecting electrode of the semiconductor device A are brazed together, and filler which contains at least thermosetting resin is injected into a space between the wiring board and the semiconductor device and hardened. The filler has such a thermal expansion coefficient of 20-50ppm/ deg.C at temperatures of 40-400 deg.C and a Young's modules of 5-10GPa in a temperature range of 40-400 deg.C.