| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer interconnection board capable of making certain the electric connection between layers. SOLUTION: This is a manufacturing method for multilayer interconnection boards 1 comprising a first process for forming inner-layer circuit patterns 3a, 3b by photolithography on an insulating board 2, a second process for forming an insulator layer 4 on it, a third process for boring connecting holes 5 having bottoms to expose an inner-layer circuit pattern 3a from the surface side of the insulator layer 4 using a laser beam, a fourth process for forming an outer conductor layer 7 on the insulator layer 4 by plating, and a fifth process for forming outer-layer patterns 7a, 7b on the outer conductor layer 7. And in a first process, holes 3c penetrating the inner-layer circuit pattern 3a are formed at positions corresponding to the connecting holes 5 having bottoms, simultaneously with the inner-layer circuit patterns 3a, 3b. |
