METHOD AND DEVICE FOR FORMING RESIST PATTERN

摘要

PROBLEM TO BE SOLVED: To make it possible to continuously process a substrate to be processed by dividing a first energy beam and a second energy beam into an electron beam having a high size controlling or micro machining region and an excimer laser having a low region respectively and by drawing them on a same resist. SOLUTION: Resist which contains two components of polyvinyl phenol and 4,4'-diazide-chalcone is applied by rotation on a silicon substrate 101 and a resist layer 102 is formed by heat treatment. An excimer laser as irradiation with a first energy beam 103 is exposed in a low requested region for micronized or size controlling property via a photo mask and a first resist reaction part 104 is formed. Additionally a drawing is made in a high requested region for a micronized or size controlling property by an electron beam as a second energy beam 106 and a second resist reaction part 107 is formed.