| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package which eliminates the generation of reflection loss, the resonance and the like of an electric signal by a method, wherein a high-frequency transmission line is formed of one pair of main conductor layers which are faced, so as to sandwich a part of a dielectric substrate and of two rows of via-hole groups which connect the main conductor layers electrically and which are arranged and installed at a specific interval in the transmission direction of a signal. SOLUTION: A dielectric substrate which constitutes a package used to house a high-frequency element comprises a mounting part on which the high-frequency element is mounted in the center on its surface, and a high-frequency transmission line 8 by which the high-frequency element is connected to an external electric circuit is formed on the dielectric substrate. The high-frequency transmission line 8 is formed of a pair of main conductor layers 8a, 8b which face each other by sandwiching at least a part of the dielectric substrate, e.g. one layer situated in the uppermost position from amon a plurality of dielectric layers 1a forming the dielectric substrate and of two rows of via-hole groups which connect the pair of main conductor layers 8a, 8b and which are arranged and installed at intervals (c) of 1/2 or lower of a cutoff frequency in the transmission direction of a signal. |
