| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board, in which the filling properties of a resin into a through-hole are improved while the quantity of the multilayer printed wiring board warped can be reduced, on which various electronic parts can be loaded surely and which has high reliability on mounting. SOLUTION: The thickness of a core board 2 in the multilayer printed wiring board 1 is adjusted within a range of 0.6-1.00mm. Consequently, the multilayer printed wiring board can resist force intending to generate warpage sufficiently in the multilayer printed wiring board 1 and warpage is prevented, and the insides of through-holes 4 are filled with a resin 5 without trouble. Accordingly, the warpage of the multilayer printed wiring board 1 with shrinkage on the curing of inter-layer resin insulating layers 6 is prevented by making the thickness of the core board 2 larger than 0.6mm, and the filling properties of the resin 5 into the through-holes 4 can be ensured by setting the thickness of the core board 2 to 1.0mm or less.</p> |
