| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated semiconductor package which is easy to be repaired at low step cost by making the whole outer size smaller. SOLUTION: An outer case having an aperture part for arranging a chip 1 is prepared in the central part, so as to arrange a second radiation board 8 on the bottom while the chip 1 is arranged in the aperture part. The chip 1 is provided with a plurality of wire bonding pads on the surface thereof and a lead 4a electrically connected to a wire bonding pad to be formed in one direction, while a first radiation board 5 connected to another wire bonding pad to be led in the other direction. Further, a cap 9 is fitted on the outer case, so that the lead 4a and the first radiation board 5 may be fixed on the junction of the cap 9 and the outer case.
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