| 摘要 |
PROBLEM TO BE SOLVED: To provide a built-up substrate having the excellent adhesive properties of a conductor pattern such as a wiring. SOLUTION: In the manufacture of the built-up substrate having a process, in which a conductor pattern is formed onto a resin film, in which a surface is roughened, by electroless plating, resin film patterns 3044a, 3044b containing no catalyst are formed to sections except resin film patterns 3064a, 3064b comprising the catalyst for electroless plating on the substrate 300 corresponding to the formation prearranged section of the conductor pattern. A process, in which the surfaces of these resin films are roughened, and electroless plating for forming the conductor pattern are conducted. |
