| 摘要 |
PROBLEM TO BE SOLVED: To prevent short-circuiting between inner leads, a crack in a packing and the wear of the movable part of a mold unit from being generated. SOLUTION: A carrying system for carrying tables 11 in a pot of a mold unit for molding a semiconductor so provided with annular frame parts, through which the tablets 11 pass, and power removing units 25 consisting of brush parts, which are provided in such a way as to extend from these frame parts to the central part between the frame parts and remove tablet power adhering to the surfaces of the tablets 11. These units 25 are installed in an air blow unit 13 consisting of a chamber 20 forming a blow chamber 19, through which the tablets 11 pass, a nozzle 22, which jets the high pressure air 21 into the tablets 11 in the chamber 19 and removes the tablet powder adhering to the surfaces of the tablets 11, and a dust collecting machine 24 which sucks the removed tablet powder. |
