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发明名称
WAFER-REAR ETCHING APPARATUS
摘要
申请公布号
JPH10189531(A)
申请公布日期
1998.07.21
申请号
JP19960340708
申请日期
1996.12.20
申请人
SONY CORP
发明人
MANABE TOYOO
分类号
H01L21/306;(IPC1-7):H01L21/306
主分类号
H01L21/306
代理机构
代理人
主权项
地址
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