| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of cleaning a printed-wiring board, which can remove a foreing substance adhered to a circuit pattern without damaging the circuit pattern. SOLUTION: In this method, cleaning of a printed-wiring board formed by providing a circuit pattern 1 in the surface of a substrate 2 is conducted. In this case, this cleaning is conducted by irradiating a laser beam 5 on the pattern 1, while this cleaning is conducted without irradiating the laser beam on an external region 6 other than the pattern 1. The intensity of the laser beam in the laser irradiation is made weaker on the side of the peripheral part of the pattern 1 than the side of the central part of the pattern 1. It is preferable that the laser 5 previously recognizes the pattern 1 in the surface of the substrate 2 and the external region 6 other than the pattern 1 to irradiate only on this pattern 1. The circuit pattern 1 is a bonding terminal for connecting a bonding wire, for example.</p> |
