| 摘要 |
PROBLEM TO BE SOLVED: To provide a resinous wiring board which has a small coefficient of thermal expansion and an anisotropy, and has an advantage that disconnection is prevented effectively at the time of solder mounting, etc., and migration- resistant characteristics are enhanced. SOLUTION: A conductive circuit is formed on an insulating wiring board made by blending an organic resin and a granular inorganic filler at a volume ratio of 20:80 to 60:40. The weight reference particle size distribution of the granular inorganic filler has at least two peaks in the range of 1 to 10μm. The peak particle size on a small particle size side is at least 80% or less of the peak particle size on a large particle size side. Particles of a particle size larger than the average particle size of the granular inorganic filler account for 50 to 90wt.% of the granular inorganic filler gross weight.
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