发明名称 CAPILLARY FOR WIRE BONDING AND BONDING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a capillary for bonding a wire to narrowly spaced pads respectively and a bonding method thereby. SOLUTION: A capillary 1 is equipped with a body, wherein the body is provided with an outer surface, a hole 23 which terminates at its edge penetrating through it, and a wall formed of the hole 23 and the outer surface. The wall is possessed of two opposed sectors 21 and 22 which confront each other at its one edge, and the sectors 21 and 22 are set separate from each other by the opposed sectors 31, a third and a fourth sector. The first sector 21 is thicker than the other sectors, and the second sector 21 is intermediate between the first sector 21 and the sectors 31 in thickness.</p>
申请公布号 JPH10189647(A) 申请公布日期 1998.07.21
申请号 JP19970348344 申请日期 1997.12.17
申请人 TEXAS INSTR INC <TI> 发明人 JOHN W OKAT
分类号 H01L21/60;B23K20/00;H01L21/603;H01L21/607;(IPC1-7):H01L21/60 主分类号 H01L21/60
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