| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a printed wiring board wherein an end part exposed conductor's area in contact with the wall face of an opening is hard to reduce, by removing the plating nucleus property of a plating nucleus from the surface of an organic substrate around the portion corresponding to the end part to be formed, and then forming a plating metal layer on the end face of the opening. SOLUTION: First, the surface of a substrate 10 and the wall surface of an opening 13 are provided with a plating nucleus 16. Then a plating resist film 20 is formed on the surface 101 of the board around its end part and the surface of the board 10 where a plating film is not to be formed. Thereby the plating nucleus 16 on the surface 101 of the board around its end part is covered to remove plating nucleus property (catalytic performance and conductive performance of plate). Then an electrodes copper plating metal film 18 and an electrolytic copper plating metal film 19 are formed on the surface of the substrate 10, and the wall surface of the opening 13 uncovered with the plating resist film 20. When the plating resist film 20 is thereafter removed, a printed wiring board is completed in which the end part 151 of an end part exposed conductor 15 is exposed at the wall surface of the opening 13.</p> |
