Extended bond pads with a plurality of perforations

摘要

Extension areas of a metal layer electrically connected to the original die bond pad allow for testing connections to be made. In this way, the connection area used for the final packaging of the die will not be damaged. The extension areas can be removed along with the testing connections. The use of perforations and/or underlayer sections can aid in the removal of the extension area. The extension area can extend over a passivation layer so that the basic die design need not be changed.