| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting type substrate structure to be used for integral formation of the encapsulation of a device by eliminating conventional packaging. SOLUTION: A surface-mounting type substrate structure, containing a substrate 10, a doped semiconductor layer 16 and a dielectric layer 14, are provided. An interconnecting aperture part, extending to the upper and the lower surfaces, is provided on the substrate 10, the doped semiconductor layer 16 is provided inside the interconnecting aperture part, on the upper surface and the lower surface of the substrate material 10, and on the region surrounding the interconnection aperture part. The dielectric layer 14 is arranged between the doped semiconductor layer 16 and the substrate 10. |
