| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, having superior flatness of the surface which becomes a connection surface and formed by the top part of a plurality of protruding electrodes, in such a manner that stabilized bondability to a printed substrate can be obtained even for a small type multi-pin semiconductor device, and to provide the manufacturing method for the semiconductor device. SOLUTION: In a process in which a conductive metal member 7, arranged on the electrode part of a substrate 2, is heat molten and connected to the electrode part of the wiring pattern of the substrate 2, and by heating up and fusing the conductive metal member 7 is heated up and fused in the state wherein a flat plate 9, consisting of material which is not metallized or alloyed with the conductive metal member 7, is brought into contact at least with one or more conductive metal members 7, a flat part 11 is characteristically provided on the part, which comes into contact with a flat plate 9 of the conductive metal member 7. Also, surfaces which are almost flush with are formed at least by one or more flat parts 11 in the manufacturing method of the semiconductor device. |
