| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat-dissipating structure, which prevents the stress in the solder part of a lead wire at a heat-generating component by a method, wherein a recessed part into which a part of a heat sink is inserted so as to be arranged is formed in the edge part of a circuit board, a protruding part is formed on the inner face of the side plate of a case so as to face the recessed part and the heat sink to which the heat-generating component is attached is sandwiched between, and held by, the recessed part in the circuit board and the protruding part at the case. SOLUTION: A heat sink 40, which is supported on a circuit board 20 is attached in such a way that the sandwiching and holding piece part of the heat sink 40 is sandwiched between, and held by, a recessed part 23 in the circuit board 20 and a flat face part 12 at a protruding part 11 formed so as to protrude on the inner face of a side plate 6 at a case and that the circuit board 20 is fitted between both side plates 6, 6 at the case. When the heat sink 40 is sandwiched between the recessed part, formed in the circuit board and the protruding part formed at the case, it is possible to eliminate a stress from being applied to the solder part in a lead wire of a heat-generating component. Then, the heat of the heat-generating component can be dissipated from the case. |
