| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method which is high in reliability and yield. SOLUTION: A substrate structure which includes substrates of different thermal expansion coefficients is bonded together through a thermal compression bonding method, in this case e.g. an optical diode array or another semiconductor substrate 14 is bonded to a silicon substrate 38 by thermocompression for the formation of an electronic device or a photoelectric device. In this method, substrate structures 14 and 38 which are mutually connected together are aligned and brought into contact with each other. Then, contact pad elements 22, 24 and 42, 44 are thermocompressed at bonging temperatures. Thereafter, an encapsulating temperature is set. Encapsulating material is fed to the bonded substrate structures. Thereafter, the encapsulating material is hardened at an encapsulating temperature. |
