| 摘要 |
PROBLEM TO BE SOLVED: To reduce the range of temperature rise in an electronic component due to irradiation energy, and reduce thermal damage to the electronic component, by preheating the electronic component to a temperature higher than ordinary temperature, and irradiating connections between the electronic component and a board with laser light or electromagnetic waves to connect them. SOLUTION: An electronic component 1 is sucked by a collet 4 on the upper face of the electronic component 1 and the lower face of the collet 4. The electronic component 1 is aligned with a board 3 so that the electrodes 1a on the electronic component 1 corresponds to the electrodes 3a on the board 3, and then placed on the board 3. The collet 4 is heated by a heater H before or after the collet 4 sucks the electronic component 1 to preheat the sucked component 1 to a temperature higher than ordinary temperature and lower than the maximum temperature at the application of thermal energy. Then the component is held placed by the collet 4 and further bumps 2 are simultaneously heated from the flank by a laser beam LB. Thus the bumps, mainly their surficial layers, are heated and melted by the thermal energy of the laser beam LB. Thereby thermal damage to the electronic component can be reduced. |
