| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit chip of large aspect ratio and its manufacturing method. SOLUTION: This integrated circuit chip package 10 contains an integrated circuit chip 12 of a larger aspect ratio. The length L1 of the chip 12 is three times longer than the width L2 thereof. The chip 12 contains a plurality of integrated circuit blocks 14 respectively having a plurality of integrated circuit parts and bond pads 16 for signal input and output. In an embodiment, the circuit functional blocks 14 aligned in parallel with one another form the lines of the circuit functional blocks 14. The integrated circuit chip 12 of the larger aspect ratio needs less wafer area than that of the chip in smaller aspect ratio, so that more chips may be manufactured from a single semiconductor wafer due to the lower cost per chip. Furthermore, the method of manufacturing the integrated circuit chip in large aspect ratio by this invention can minimize cracking possibility of the integrated circuit chip 12 of the large aspect ratio in the packaging process. |
