发明名称 Grinding wheel having abrasive tips
摘要 A grinding wheel with tips which can be uniformly abraded regardless of the position of the tips is disclosed. In the wheel, the inside and outside tips may be formed by bonding diamond dust of the same concentration with resinoid or metal bonds of lower and higher abrasion resistances, respectively. Alternatively, the inside and outside tips may be formed using the same resinoid or metal bond. In this case, the outside tips are laden with diamond dust, while the inside tips are laden with no diamond dust or cheap abrasive. As a further alternative, the concentration of the diamond dust of the tips may be stepwisely reduced from the outside toward the inside. In addition, the top surface of each tip may be inclined downward from the outside toward the inside to compensate for the eccentric abrasion of the tips due to the circumferential speed difference between the inside and outside tips.
申请公布号 US5782682(A) 申请公布日期 1998.07.21
申请号 US19960657277 申请日期 1996.06.04
申请人 EHWA DIAMOND IND. CO. LTD. 发明人 HAN, JUNG SU;YUN, SO YOUNG
分类号 B24D3/00;B24B7/22;B24D7/06;B24D7/14;(IPC1-7):B24B5/00 主分类号 B24D3/00
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