| 摘要 |
A dental resin composition is presented, comprising an ethoxylated bisphenol A dimethacrylate having the formula CH2=C(CH3)CO2(C2H4O)xC6H4C(CH3)2C6H4(OC2H4)yO2CC(CH3)=CH2 wherein x + y is an integer from 1 to 20, and preferably from 2 to 7, together w ith a methacrylate oligomer and an optional diluent monomer. The composition is suitab le for use for dental fillers adhesives, and the like, and has improved water sorpt ion and excellent wear resistance.
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