| 摘要 |
The process uses a plastic plate (2) made with cavities (5) which traverse the plate and extend along most of the lines of separation (30) prior to joining to the glass plate (1) with the spacer (11) between. The glass plate is notched along the lines of separation and the device is broken along these lines. The plastic is chosen with a high resistance to shock, in the context of a fracture by a single action, and the glass has less resistance. A criss-cross network of lines with a thin film transistor at each intersection is formed on the inward glass surface. Electrodes are formed on each inward surface and a colour filter may be placed on the inward plastic surface. |
