发明名称 |
INTEGRAL LID/CLAMP FOR HIGH POWER TRANSISTOR |
摘要 |
An integral semiconductor package and mounting structure in which a lid for sealing a semiconductor chip on a platform includes flanges extending beyond the platform with the flanges having holes for receiving screws for mounting the package to a heat sink. The flanges are flexed into engagement with a heat sink thereby maintaining the package in yieldable pressure engagement with the heat sink. |
申请公布号 |
WO9831202(A2) |
申请公布日期 |
1998.07.16 |
申请号 |
WO1998US00460 |
申请日期 |
1998.01.06 |
申请人 |
SPECTRIAN, INC.;AVIS, STEVEN, E. |
发明人 |
AVIS, STEVEN, E. |
分类号 |
H01L23/40 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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