Mikromechanische Halbleiteranordnung und Verfahren zur Herstellung einer mikromechanischen Halbleiteranordnung

摘要

The invention relates to a micromechanical semiconductor array comprising a membrane (7) formed inside a hollow space (9). The membrane (7) is configured by a crystalline layer inside the substrate (1) or inside an epitaxial layer sequence of the semiconductor array placed inside a substrate (1). The membrane (1) is placed on the edge segment on a support (6) and covered by a covering layer (4) held on a counter-support (5). The support (6), the counter-support (5) and the membrane are all made of materials with different etching rates in relation to a predetermined wet-chemical etching agent and preferably consist of materials with different doping.