An electronic endoscope with which the electrical insulation between side faces of a solid-state imaging element and inner leads of a flexible circuit board will be secured and with which the external dimension after assembly of the unit comprised of the solid-state imaging element and the flexible circuit board can be made small. The inner leads of the flexible circuit board are bonded to pad parts disposed on the solid-state imaging element, and these inner leads are bent so as to be disposed along the side faces of the solid-state imaging element. An electrically insulating tape is attached to the side faces of the solid-state imaging element along which inner leads are disposed.
申请公布号
DE19800931(A1)
申请公布日期
1998.07.16
申请号
DE1998100931
申请日期
1998.01.13
申请人
ASAHI KOGAKU KOGYO K.K., ITABASHI, TOKIO/TOKYO, JP