LEAD FRAME RETAINING APPARATUS

摘要

A holding device of a frame retainer on a retainer holder used in bonding machines for manufacture of semiconductor devices including a pair retainer guides formed in the retainer holder so that the frame retainer is positionally secured between the retainer guides by positioning pins which are pushed and moved by spring members. The positioning pins are movable toward and away from the frame holder by turning (overcoming the spring force of the spring members) eccentric pins which are in contact with the positioning pins.