发明名称 Method for making a printed wiring board
摘要 Described is a method of making a double-sided printed wiring board (PWB) comprising a core of electrically conductive material to improve the thermal distribution and cross-talk shielding of the PWB. Relief apertures and separation slots are chemically milled into the core. A layer of particulate-free dielectric material and a layer of conductive material are laminated to both sides of the core and dielectric material substantially fills the relief apertures during lamination. Holes are drilled through the PWB at the relief apertures to accommodate electrical communication between both sides of the board. Holes are also drilled through the conductive material of the core to accommodate an electrical ground. The surface of the PWB and the side walls of the holes are coated with a second layer of electrically conductive material.
申请公布号 US5779836(A) 申请公布日期 1998.07.14
申请号 US19960741825 申请日期 1996.10.31
申请人 KERRICK, JON P. 发明人 KERRICK, JON P.
分类号 B32B15/08;H05K1/05;H05K3/00;H05K3/06;H05K3/42;H05K3/44;(IPC1-7):H05K3/10 主分类号 B32B15/08
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