| 发明名称 |
RF transistor package and mounting pad |
| 摘要 |
An improved semiconductor package is provided wherein the mounting pad for the semiconductor is made from a material selected from the group consisting of aluminum nitride, diamond, alumina, and boron nitride.
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| 申请公布号 |
USRE35845(E) |
申请公布日期 |
1998.07.14 |
| 申请号 |
US19940235022 |
申请日期 |
1994.04.28 |
| 申请人 |
SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
BUTERA, GASPER |
| 分类号 |
H01L23/04;H01L23/02;H01L23/373;H01L23/64;H01L23/66;(IPC1-7):H01L39/02 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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