| 摘要 |
A heat dissipation apparatus for dissipating heat of a semiconductor chip module is disclosed. The heat dissipation apparatus includes a base, a plurality of fins, and a heat transfer pipe. The heat transfer pipe has a first opening and a second opening. The first opening is adjacent to the fins which are arranged over the base. The second opening is in a cooling ambient. The heat generated from the semiconductor chip module is conducted away by the base, the fins and then transferred into the cooling ambient through the heat transfer pipe.
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