METHOD FOR RECOVERING COPPER FROM GLASS EPOXY SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method for easily recovering copper from waste printed circuit boards at a low cost. SOLUTION: The glass epoxy substrates 1 from which packaging parts are removed are immersed at >=60 to <130 deg.C in an aq. sulfuric acid soln. 4 of a concn. of >=70wt.% to change the copper on the substrate to copper sulfide, which is separated. The copper sulfide 3 settled in the aq. sulfuric acid soln. 4 is recovered by filtering. The other method consists in immersing the glass epoxy substrates 1 at >=40 to <60 deg.C in the aq. sulfuric acid soln. 4 of the concn. of >=70wt.%, then peeling the copper from the substrate and recovering the copper.