Method for controlling warp of electronic assemblies by use of package stiffener

摘要

A method of controlling warp of electronic assemblies includes mounting a first component to one side of a substrate, the first component having a different coefficient of thermal expansion (CTE) than the substrate and thereby tending to generate bending moments that distort the shape of the first component, and mounting a second component to an opposite side of the substrate and opposite the first component. The second component has a CTE that approximately matches that of the first component, thereby tending to generate bending moments that offset the distorting bending moments.