发明名称 |
Cleaning solder-bonded flip-chip assemblies |
摘要 |
Cleaning of a micromimiature high-density flip-chip assembly is carried out by spinning the assembly while applying cleaning fluid to a central portion of the assembly. Confinement of the cleaning fluid to a critical interconnection space of the assembly is ensured by a centrally apertured cover that resiliently engages the top of the assembly. During spinning, cleaning fluid is introduced through the aperture in the cover and is directed into and confined to flow radially in the interconnection space.
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申请公布号 |
US5778913(A) |
申请公布日期 |
1998.07.14 |
申请号 |
US19970803474 |
申请日期 |
1997.02.20 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
DEGANI, YINON;DUDDERAR, THOMAS DIXON;KOSSIVES, DEAN PAUL |
分类号 |
B08B3/04;H01L21/00;(IPC1-7):B08B3/02 |
主分类号 |
B08B3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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