发明名称 Heat dissipating lid hinge structure with laterally offset heat pipe end portions
摘要 A notebook computer display housing is pivotally connected to its associated CPU housing by a heat dissipating hinge structure having telescoped, relatively rotatable first and second sections respectively anchored to the CPU and display housings. The heat absorbing evaporation end of a first thermosyphoning heat pipe is conductively connected to a heat generating electronic component within the CPU housing, with the heat rejecting condensing end of the heat pipe defining the first hinge structure section. During computer operation, heat from the electronic component is sequentially transferred through the heat pipe and the second hinge structure section, in which the first hinge section is journaled, to the display housing for dissipation therefrom to ambient. Heat transfer from the second hinge structure section to the display housing is representatively facilitated by a second thermosyphoning heat pipe having an evaporator end received in an opening in the second hinge structure section, and laterally offset from the condensing end of the first heat pipe, and a condensing end thermally communicated with the display housing.
申请公布号 US5781409(A) 申请公布日期 1998.07.14
申请号 US19960769795 申请日期 1996.12.19
申请人 COMPAQ COMPUTER CORPORATION 发明人 MECREDY, III, HENRY E.
分类号 H05K5/03;F28D15/02;G06F1/16;G06F1/20;H01L23/367;H05K7/20;(IPC1-7):G06F1/20 主分类号 H05K5/03
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