发明名称 |
SOLDERING INSPECTION EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To reliably decide whether soldering is acceptable or not. SOLUTION: An image pickup unit 8 picks up the image of a specified region on a printed board 2 including an electrode to be soldered. A data processor 6 makes smooth the brightness at respective parts of an image being picked up by the image pickup unit 8 at an image processing section 61 thereof and emphasizes the brightness contrast for a smoothed image. A decision is then made whether a soldered state is acceptable or not based on an image subjected to brightness contrast emphasis. |
申请公布号 |
JPH10185528(A) |
申请公布日期 |
1998.07.14 |
申请号 |
JP19960357895 |
申请日期 |
1996.12.26 |
申请人 |
TOYOTA CENTRAL RES & DEV LAB INC |
发明人 |
KITAYAMA TSUNAJI;WATANABE KEIICHI |
分类号 |
G01B11/24;G06T1/00;G06T5/20;G06T7/00;H05K3/34;H05K13/08 |
主分类号 |
G01B11/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|