发明名称 SOLDERING INSPECTION EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To reliably decide whether soldering is acceptable or not. SOLUTION: An image pickup unit 8 picks up the image of a specified region on a printed board 2 including an electrode to be soldered. A data processor 6 makes smooth the brightness at respective parts of an image being picked up by the image pickup unit 8 at an image processing section 61 thereof and emphasizes the brightness contrast for a smoothed image. A decision is then made whether a soldered state is acceptable or not based on an image subjected to brightness contrast emphasis.
申请公布号 JPH10185528(A) 申请公布日期 1998.07.14
申请号 JP19960357895 申请日期 1996.12.26
申请人 TOYOTA CENTRAL RES & DEV LAB INC 发明人 KITAYAMA TSUNAJI;WATANABE KEIICHI
分类号 G01B11/24;G06T1/00;G06T5/20;G06T7/00;H05K3/34;H05K13/08 主分类号 G01B11/24
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